NTT develops high-speed IC supporting wireless transmission of 100 gbps in a 300 GHz band

The research was supported in part by the research and development program on multi-tens gigabit wireless communication technology at subterahertz frequencies of Ministry of Internal Affairs and Communications, Japan.


Devdiscourse News Desk | Updated: 11-06-2018 20:06 IST | Created: 11-06-2018 19:56 IST
NTT develops high-speed IC supporting wireless transmission of 100 gbps in a 300 GHz band
NTT and and Tokyo Institute of Technology have developed a high-speed IC supporting wireless transmission of 100 gbps in a 300 GHz band. (Image Credit: Twitter)
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  • Japan

Japanese telecommunications company Nippon Telegraph and Telephone Corporation (NTT) and Tokyo Institute of Technology have mutually developed an ultra high-speed IC for wireless front-end that operates on a terahertz frequency band, and in the 300 GHz band they have succeeded in developing the world's fastest 100 gigabits per second wireless transmission data rate.

NTT told in a press statement, "In this research, we implemented a mixer circuit that applied a unique proprietary high isolation design technology with an Indium phosphide high electron mobility transistor (InP-HEMT). This enlarged the transmission bandwidth, which is a problem in the conventional 300 GHz band wireless front end. It also improved the signal-to-noise ratio (SNR). In addition, using this we realized a 300 GHz band wireless front-end module, and we achieved wireless transmission of 100 Gbps (gigabits per second)."

The details of this technology will be disclosed at the 2018 IEEE MTT-S International Microwave Symposium which is being held in Philadelphia in the United States from June 10 to 15.

The research is expected to use multiple carriers or spatial multiplexing technology such as MIMO and OAM in the near future, together with the present outcomes and with this combination, the researchers expect to attain an ultra high-speed IC technology that enables high-capacity wireless transmission of over 400 Gbps.

It is expected to be an ultra high-speed IC technology that enables high-capacity wireless transmission of 400 gigabits per second. This is about 400 times the current LTE and Wi-Fi, and 40 times 5G, the next-generation mobile communication technology. 

The research was supported in part by the research and development program on multi-tens gigabit wireless communication technology at subterahertz frequencies of Ministry of Internal Affairs and Communications, Japan.

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