South Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment

​South ‌Korean President ​Lee ‌Jae Myung said on Thursday that ‌Samsung Electronics' 6 trillion ‌won ($4.48 billion) investment in ⁠a ​high-bandwidth memory ⁠chip packaging plant ⁠in Asan, ​South Korea, would ⁠be followed by about ⁠40 ​trillion won in ⁠investment in advanced equipment.

($1 = ⁠1,339.5500 ⁠won)