Intel Collaborates with Odisha for Advanced Substrate Manufacturing in India

Intel has partnered with the Odisha government and 3DGS to bring advanced semiconductor substrate manufacturing technology to India, investing approximately USD 3.3 billion in the project. This initiative aims to boost India's semiconductor ecosystem and is set to generate significant employment opportunities.

Intel Corporation has joined forces with the Odisha government and 3DGS to introduce semiconductor substrate manufacturing technology to India. This collaboration highlights a substantial step towards strengthening the nation's semiconductor capabilities.

The memorandum of understanding was signed with participation from electronics and IT minister Ashwini Vaishnaw and Odisha's chief minister, Mohan Charan Majhi. The agreement signals a significant investment in India's high-tech sector, with an estimated budget of USD 3.3 billion. The initiative aims to create over 1,800 direct high-skilled jobs and substantial indirect employment.

Set in the Bhubaneswar-Khurda region, the project will ultimately enhance India's technological landscape, focusing on innovations in advanced packaging and high-density interconnect substrates. Apart from operational progress, the agreement marks a milestone with India's India Semicon Mission 2.0, reflecting the global industry's trust in India.