China's Surprise: EUV Progress Shakes Semiconductor World

China has clandestinely developed a prototype EUV lithography machine, potentially accelerating their semiconductor independence efforts. Built by ex-ASML engineers, this device is operational yet unrefined. With aspirations to produce chips by 2030, the initiative highlights China's push for self-reliance in high-tech sectors amid heightened U.S. export restrictions.

In a high-security facility in Shenzhen, China's once-secret endeavor to produce its own EUV lithography machine has come to light. This ambitious project, involving the expertise of former ASML engineers, marks a significant leap in China's journey toward semiconductor self-sufficiency.

The current prototype occupies an entire factory floor, testifying to China's determination to break the West's monopoly on cutting-edge chip-making technology. Despite the machine's operational status, it is yet to achieve the production of functional chips, sources reveal.

As geopolitical tensions over technology escalate, China aims to reach chip autonomy by 2030. This surprise advancement could challenge analysts' timelines, signaling a reshaping of global semiconductor dynamics.

(With inputs from agencies.)